Composite wood products
Mohamad Noorirad; Hedayatolah Aminian; Loya Jamalirad; Vahid Vaziri
Abstract
Background and objectives: Many studies have been conducted on the use of cellulosic resources to provide portion of raw materials for wood and paper industries. Waste branches for some species such as palm and Prosopis cineraria in southern parts of country can be a solution for deficiency of raw material ...
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Background and objectives: Many studies have been conducted on the use of cellulosic resources to provide portion of raw materials for wood and paper industries. Waste branches for some species such as palm and Prosopis cineraria in southern parts of country can be a solution for deficiency of raw material in wood and paper industries. This study investigated the possibility of using a combination of Prosopis cineraria and industrial wood particles to produce particleboard with acceptable physical and mechanical properties.Methodology: The variables in this study were the ratio of Prosopis cineraria to industrial wood particles at four levels (0:100, 15:85, 30:70, 45:55) and urea formaldehyde resin at two levels (10 and 12 percent). Industrial wood particles from Sanate Choube Shomal Company and Prosopis cineraria particles were obtained from the province of Sistan and Baluchistan. Ammonium chloride as a hardener was used at 2 percent of the dry weight of the adhesive. After mixing raw material, the mat was placed under hot pressing at a temperature of 170 ˚C for 6 minutes. After the manufacture of the single-layer particleboard, the physical and mechanical properties of the boards were analyzed by a factorial test in a completely randomized design with a confidence level of 5%. Results: The results showed that the physical and mechanical properties of the panels decreased as the percentage of mixture Prosopis cineraria particles increased. So that, panels containing 45% Prosopis cineraria particles and 10% urea-formaldehyde resin had the lowest mechanical properties, while panels containing 12% urea-formaldehyde resin without Prosopis cineraria s particles had the best mechanical properties. Panels containing 45% Prosopis cineraria particles and 12% urea-formaldehyde resin had the lowest water absorption and thickness swelling, while panels containing 10% urea-formaldehyde resin without Prosopis cineraria particles had the highest.Conclusion: According to the results of this study, there was usability of boards with 15% Prosopis cineraria particles and 10% resin for Type P1 boards and the boards with 15% Prosopis cineraria particles and 12% resin for Type P2 boards.
Mohammad reza Pesarklo; Abolghasem khazaeian; Mohammad reza Mastari frahani
Abstract
The objective of this study was to examine the effect of Paulownia particles addition and pressing time on the surface quality of particleboard made. In this regard, Paulownia chips and industrial chips were used in surface and core layers, respectively. Urea-formaldehyde resin was applied at 12% for ...
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The objective of this study was to examine the effect of Paulownia particles addition and pressing time on the surface quality of particleboard made. In this regard, Paulownia chips and industrial chips were used in surface and core layers, respectively. Urea-formaldehyde resin was applied at 12% for surface layer and 8% for core layer. Variables include Paulownia chips charges at 3 levels of 10, 20 and 30 percent and 2 pressing time (6 and 8 minutes). To evaluate surface roughness of the samples a completely randomized design was used and 8 roughness parameters include average roughness (Ra), maximum roughness (Rmax), average bumps and troughs (Rz), maximum vale depth under the average (Rv), maximum peak on the average line (Rp), Abbott group parameters included Rk, Rpk, Rvk, were measured according to ISO4287 standard using roughness measuring device available in Grogan university of agricultural sciences and natural resources. Surface quality of the particleboard improved as the pressing time (6 to 8 minutes) and the Paulownia chips charges (10 to 30 percent) increased.
