Document Type : Research Paper
Authors
1 M.Sc. in Wood Science & Technology Islamic Azad Univ. (Tehran)
2 Assistant Prof. of Wood Science & Technology Dep., Science and Research Branch, Islamic Azad Univ. (Tehran)
3 Research assistant Prof, Institute of Forests and Rangelands, Wood Technology Dep. Karaj, Iran
Abstract
In this study, aspen chips with OCC (Old Corrugated Container) were used in particleboard production and samples were prepared at two different levels of resin contents (%9 and %10) and three levels of combination:
1- %25 OCC +%75 aspen, 2- %50 OCC + %50 aspen, 3- %75 OCC +%25 aspen. Indeed in this study these two mentioned factors are variable and other factors such as press temperature: 165 ºC, press time: 5 minute, mat moisture %12, board density 0.75 g/cm3 and press pressure 30 kg/cm2 were constant. After the boards were manufactured according to DIN-68763 standard, were undergone different tests such as: bending strength, modulus of elasticity, internal bonding strength and thickness swelling after 2 & 24 hours immersion in water. The results indicate that second ratio(%50 OCC and %50 aspen chips) is proper for bending applications and the first ratio(%25 OCC and %75 aspen chips) is proper for tensile and thickness swelling applications. Therefore, applying the OCC more than %50 in manufacturing combination; result in decreasing the physical and mechanical properties. Moreover the results show that when the resin content increases, the board features improve.
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