Document Type : Research Paper

Authors

1 M.Sc., Woodand Paper Science and Technology Department, Faculty of Natural Resources, Wood and Paper Planet Responsible, Noor, Iran

2 head of the department of E-learning

3 Associate Prof., Wood Science and Technology Department, Materials Engineering & New Technologies Faculty, Shahid Rajaee Teacher Training University, Lavizan, Tehran, Iran

4 Department of wood and paper sciences, Faculty of natural resources, Tarbiat Modares University, Iran

Abstract

In this research, Effect of soy flour addition into urea-formaldehyde resin on physical, mechanical properties and formaldehyde emission of plywood was investigated. Soy flour was mixed with urea-formaldehyde adhesive in three levels 5, 10 and 15% (based on dry weight of urea-formaldehyde adhesive) and three-layer plywood was manufacture from the resultant adhesive and poplar veneer. Properties of manufactured plywood including formaldehyde emission according to EN-717-3 standard, shear strength according to EN-314 standard and water absorption and thickness swelling according to EN-317 standard were investigated. The results indicated that addition of soy flour up to 15% decreased formaldehyde emission up to 29.34% and increased shear strength of panels. Moreover, delamination test (According to ANSI/HPV-HPV1 Standard) presented acceptable results. The results obtained from water absorption and thickness swelling after 2h and 24h showed that addition of soy flour increased the amount of water absorption and thickness swelling.
thickness swelling after 2h and 24h showed that addition of soy flour increased the amount of water absorption and thickness swelling.

Keywords

Main Subjects

-American National Standard for Hardwood and Decorative Plywood, 2009. ANSI/HPVA HP-1, 36 pp.
-Aydin, I., Colakoglu, G., Colak, S. and Demirkir, C., 2006. Effects of moisture content on formaldehyde emission and mechanical properties of plywood. Building and Environment, 41:1311–1316.
-Chen, N., Lin, Q., Zeng, Q. and Rao, J., 2013. Opimization of Preparation Conditions of Soy Flour Adhesive for Plywood by Response Surface Methodology.Industrial Crops and Products, 51: 267-273.
-Costa N A D., Pereira J., Ferra J., CruzP., Martins J M., Magalhães, F.D., Mendes A. and Carvalho L. H., 2014. Formaldehyde emission in wood based panels: Effect of curing reactions. International Wood Products Journal, 5(3):146-160
-Costa, N.A., Pereira, J., Ferra, J., Cruz, P., Martins, J., Magalhaes, F.D., Mendes, A. and Carvalho, L.H., 2013. Scavengers for achieving zero formaldehyde emission of wood-based panels. Wood Science and Technology, 47:1261–1272.
-Dunky M., 1998. Urea-formaldehyde (UF) adhesive resins for wood. International Journal of Adhesion and Adhesives, 18: 95–107.
-Gui, C., Wang, G., Wu, D., Zhu, J. and Liu, X., 2013. Synthesis of a Bio-based Polyamido amine Epichoro hydrin Resin and its Application for Soy-based Adhesive. International Journal of Adhesion and Adhesives, 44:237-242.
-Hettiarchchy N.S., Kalapathy U. Myers D.J., 1995. Alkali-Modified Soy Protein with Improved Adhesive and Hydrophobic Properties, Journal of the American Oil Chemists Society, 72(12): 1461-1464
-Kord, B., Sheikholeslami, A. and Najafi, A., 2016. A Study on Creep Behavior of a Wood Flour-Polypropylene Nanoclay Hybrid Composite. Iranian journal of wood and paper industries, 7(1): 1-12. (In Persian).
-Liang, W., Lv, M. and Yang, X., 2016. The effect of humidity on formaldehyde emission parameters of a medium-density fiberboard: Experimental observations and correlations. Building and Environment, 101, 110-115.
-Li, Y., Song, Z., Ding, Y., Xin, Y., Wu, T., Su, T. and Lian, Z., 2016. Effects of formaldehyde exposure on anxiety-like and depression-like behavior, cognition, central levels of glucocorticoid receptor and tyrosine hydroxylase in mice. Chemosphere, 144, 2004-2012.‏
-Marutzky R., Roffael E. and Ranta I., 1979. Untersuchungen uber den Zusammenhang zwischen dem Molverhaltnis und der Formal dehydabgabe bei Harnstoff-formaldehyde-Leimharzen. Holz als Roh-Werkstoff, 37(2):303-307.
-Roffael, E., Schneider, T. and Dix, B., 2015. Influence of moisture content on the formaldehyde release of particle-and fibreboards bonded with tannin–formaldehyde resins. European Journal of Wood and Wood Products, 73(5), 597-605.‏
-Moubarik, A., Mansouri, H.R., Pizzi, A., Allal, A., Charrier, F., Badia, M.A. and Charrier, B., 2013. Evaluation of mechanical and physical properties of industrial particleboard bonded with a corn flour–urea formaldehyde adhesive. Composites: Part B, 44: 48–51
-Meyer B. and Hermanns K., 1986. Formaldehyde release from wood products: An overview. ACS Symposium Series; American Chemical Society: Washington, DC, USA.
-Sun, X. and Bian, K., 1999. Shear Strength and Water Resistance of Modified Soy Protein Adhesives. Journal of the American Oil Chemists Society, 76 (8): 977-980.
-Tanford C., 1968. Protein Denaturation in Advances in Protein Chemistry, edited by C.B. Anfinsen, M.L. Anson, J.T. Edsall, and F.M. Rechards, Academic Press, Inc., 121-281.
-Zhang, Y., Zhu, W., Lu, Y., Gao, Zh. and Gu, J., 2014. Nano-scale Blocking Mechanism of MMT and its Effects on the Properties of Polyisocyanates-modified Soybean Protein Adhesive. Industrial Crops and Products, 57: 35-42.
-Zhu D. and Damodaran S., 2014. Chemical Phosphorylation Improves the Moisture Resistance of Soy Flour-based Wood Adhesive, Journal of Applied Polymer Science, DOI: 10.2002/APP.40451.