Document Type : Research Paper
Authors
1 M.Sc., Student, Department of Wood Science and Technology, Faculty of Natural Resources, University of Zabol, Zabol, Iran
2 Head of Department of Wood and Paper Industries,University of Zabol, Zabol, Iran
3 Assistant Professor, Department of Wood Science and Technology, Faculty of Natural Resources, University of Zabol, Zabol, Iran
4 Assistant Professor, Department of Chemistry, Faculty of Science, University of Zabol, Zabol, Iran
Abstract
This objective of this investigation was to modify and improve the water resistance of urea formaldehyde (UF) bonded particleboard adding Boric acid to the resin. Four levels (1, 2, 3 and 4) of boric acid based on the dry weight of the bonder were added to the UF resin. Then these mixtures were used to produce particleboard. Physical and mechanical properties were examined according to the ASTM, D1013-04. The results showed that the using of this additive increased the water absorption and thickness swelling resistance after 2 and 24 hours immersion in water. Also using this additive increased the internal bonding of the boards after 24 hours after immersion in water, compared to the control sample but in the case of dry samples, the internal bonding decreased compared to the control sample. However it was not lower than standard value. As the Boric acid levels increased to 2 percent, bending strength of the samples was increased compare to the control sample and after this level it was decreased. Also with increasing the levels to 4 percent, modulus of elasticity of boards were increased compare to the control sample
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