- دوستحسینی، کاظم، 1380، فناوری تولید و کاربرد صفحات فشردهی چوبی. انتشارات دانشگاه تهران، 708 صفحه.
- میرشکرایی، س.ا، 1373. شیمی و تکنولوژی چسب چوب (ترجمه). مرکز نشر دانشگاهی تهران، 350 صفحه.
-Dea Park, B. Lee, S., Roh, J., 2008. Effects of formaldehyde/ urea mole ratio and melamine content on hydrolytic stability of cured urea- melamine- formaldehyde resin. Eur. J. Wood P. 67: 121-123.
-DIN Standards No.68763., 1990. Flat Pressed Particleboard for Use in Building Construction.
-Dinwoodie, J.M., 1977. Causes of deterioration of UF chipboard under cyclic humidity conditions: I. Performance of UF adhesive films. Holzforschung, 31(2): 50-55.
-Ko, K., 1976. How to control pollution of formaldehyde for formaldehyde series thermosetting resin adhesives. (in Japanese). Settyaku Kyokaishi. 12 (5): 160-166.
-Meyer, B., Hermanns, K., Smith, D.C., 1985. Formaldehyde release from urea- formaldehyde bonded wood products. Journal of Adhesion, 17(4): 297-308.
-Myers, G.E., 1984. How mole ratio of UF resin affects formaldehyde emission and other properties: a literature critigue. Forest Products Journal, 34 (5): 35- 41.
-Petersen, H., 1972. Zur formaldehyde absplatung bei der spanplattenerzeugung mit Harnsto ff- formaldehyde- bindemitteln. Holz als Roh- und werkstoff, 30 (1): 429- 436.
-Petersen, H., 1973. Zur formaldehyde absplatung bei der spanplattenerzeugung mit Harnsto ff- formaldehyde- bindemitteln. Holz als Roh- und werkstoff, 31 (12): 463- 469.
-Petersen, H., 1973. Zur formaldehyde absplatung bei der spanplattenerzeugung mit Harnsto ff- formaldehyde- bindemitteln. Holz als Roh- und werkstoff, 32 (10): 402- 410.
-Que, Z., Furuno, T., katoh, S., Nishiuo, Y., 2007. Effects of urea- formaldehyde resin mole ratio on the properties of particleboard. Building and Environment, 42: 1257-1263.
-Roffael, E., 1976. Effect of formaldehyde content on the reactivity of urea formaldehyde resins and formaldehyde release from UF- bonded particleboard. Hoz Roh. Werkst, 34: 385-390.
-Rowell٫ R.M.٫ 2005. Hand Book of Wood Chemistry And Wood Composites. CRC Press٫ 487ps.
-Steiner, P.R., 1978. Durability of urea- formaldehyde adhesives: Effects of molar ratio, second urea and filler. Journal of Wood Science, 23 (12): 32-38.
-Sundin, B., Hanetho, P., 1978. Formaldehyde emission from particleboard and other building materials. In: Maloey TM, editor. Proceedings International Particleboard Symposium No.12. Washington State of university: Pullman, WA.USA. P. 251-286.
-Tornita, B., 1980 How chemical structure of UF resin affects formaldyhyde emission (in Japanese). Mokuzai Kogyo, 35 (5): 193-199.
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